Since our establishment in 1996, we are one of the professional PCB manufacturing and assembly service providers in China, serving global experts, engineers and manufacturers. With over two decades of experience in custom printed circuit board development, fabrication, assembly and testing, we are capable of providing a full range of services, from rapid PCB prototyping, board fabrication, PCB assembly to component sourcing services, all with guaranteed quality and cost-effective price.
POE has invested heavily in the world's most advanced modern manufacturing and test equipment and software, from United States, Japan, Germany, Israel, Italy and Taiwan. We manufacture high-level HDI PCB’s, high frequency PCB’s, high TG PCB’s, Rogers PCB’s, flex and rigid-flex PCB’s, along with other high-tech products.
There are 4 SMT production lines, equipped with new imported Fuji XPF, NXT3, automatic solder paste printing machine, ten/twelve temperature zone reflow oven, AOI, SPI and other high-end equipment, especially good at high-precision, high-complexity single plate.
Manual soldering is generally used when a PCB design incorporates some parts that are not suitable for either reflow or wave soldering.
POE employs a staff of highly skilled manual soldering specialists to take care of any such requirements, who provide consistent and reliable workmanship even up to IPC-A-610 Class 3 Standards.
For double-sided SMT projects, the boards will need to be reflowed once for each side. A special adhesive is applied underneath the components that were soldered in the first run to prevent them from detaching and falling off the board when their solder is re-heated.
AOI Automatic Optical Inspection
Automated optical inspection (AOI) is an automated visual inspection of printed circuit board (PCB) (or LCD, transistor) manufacture where a camera autonomously scans the device under test for both catastrophic failure (e.g. missing component) and quality defects.
Not only does X-Ray inspection detect issues in PCB assembly, but the analysis of an X-Ray image can help to determine the root cause of a given defect, such as insufficient solder paste, skewed part placement, or improper reflow profile.