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PCB Capability
We are a one-stop printed circuit board manufacturer and quick turn PCB assembly solution. Offering some of the most advanced PCB technology and convenient manufacturing and assembly services found in the industry: Full Spec PCBs, Small Quantity - Quick Turn PCBs, Custom Spec - Quick Turn PCBs, Highly Specialized Precision PCBs, & Large Scale Production (No order is too small or too large).
POE is one of the few PCB suppliers that is able to manufacture PCBs to support government programs. Since we are not a broker, all our printed circuit boards are made in our China factory (100% Made in China) with a broad range of advanced capabilities for high reliability, precision, and powerful PCB performance for critical applications.
| ITEM |
Capability |
| Layers |
1-28 |
| Thicker Copper |
1-6OZ |
| Products Type |
HF(High-Frequency)&(Radio Frequency) board, Impedance controlled board , HDI board ,BGA& Fine Pitch board |
| Solder Mask |
Nanya&Taiyo ;LPI & Matt Red, green, yellow,white, blue,black. |
| Base material |
FR4(Shengyi China、ITEQ, KB A+,HZ), HI-TG, FR06, Rogers,Taconic、Argon、Nalco、Isola and so on |
| Finished Surface |
Conventional HASL,Lead-free HASL,Falsh Gold, ENIG (Immersion Gold)OSP(Entek), Immersion Tin,ImmersionSilver,Hard Gold |
Selective Surface
Treatment |
ENIG(immersion Gold)+OSP, ENIG(immersion Gold)+Gold Finger,Flash Gold +Gold Finger, immersion Silver+ Gold Finger, Immersion Tin+Gold Finger |
| Technical Specification |
Minimum line width/gap:3.5/4mil(laser drill)
Minimum hole size:0.15mm(mechanical drill)/4mil(laser drill)
Minimum Annular Ring: 4mil
Max Copper thickness: 6OZ
Max Production size:900×1200mm
Board Thickness:D/S: 0.2-7.0mm, Multilayers:0.40-7.0mm,
Min Solder Mask Bridge:0.08mm
Aspect ratio: 15:1
Plugging Visa capability: 0.2-0.8mm |
| Tolerance |
Plated holes Tolerance:0.08mm(min±0.05)
Non-plated hole tolerance:0.05min(min+0/-0.05mm or +0.05/-0mm)
Outline Tolerance:0.15min(min±0.10mm)
Functional test :
Insulating resistance : 50 ohms (mormality)
Peel off strength: 1.4N/mm
Thermal Stress test :2650c,20 seconds
Solder mask hardness:6H
E-Test voltage :500V+15/-0V 30S
Warp and Twist: 0.7% (semiconductor test board≤0.3% ) |
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